About NXP Semi-Conductors

Your Emergency PAL smart card is built with components made by NXP Semi-Conductors – formally a division of Philips.

Here follows some extracts from their corporate web site which allows you greater insight into the company who supplies our base smart cards.

NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.36 billion in 2012.


Facts & Figures

  • Key figures
    • President and CEO: Rick Clemmer
    • Net Revenue: $4.36 billion (2012)
    • Established: 2006 (formerly a division of Philips)
    • 50+ years of experience in semiconductors
    • Headquarters: Eindhoven, The Netherlands
  • Businesses
    • High Performance Mixed Signal (Automotive, Identification,
    • Infrastructure & Industrial, Portable & Computing)
    • Standard Products
    • Revenue per country (2012)
  • China 39%
  • Netherlands 2%
  • Taiwan 3%
  • United States 7%
  • Singapore 10%
  • Germany 10%
  • South Korea 5%
  • Other countries 24%
  • Customers
    • Our 10 largest OEM customers are: Apple, Bosch, Continental, Delphi, Gemalto, Giesecke/Devrient, Huawei, NSN, Panasonic and Samsung.
    • Our three largest distribution partners are: Arrow, Avnet, and WPG
  • Research & Development
    • Annual R&D expenses: $628 million (2012)
    • 3,500 employees in Research & Development
    • Approx. 10,000 issued and pending patents
    • Design engineering teams in 19 locations
    • Participation in over 80 standardization bodies & consortia
  • Locations
    • Research and development activities in Asia, Europe, and the United States, and manufacturing facilities in Asia and Europe.
    • Manufacturing facilities worldwide:
6 wafer fabs

  • Hamburg
  • Jilin
  • Manchester
  • Nijmegen (2 fabs)
  • Singapore
6 test and assembly sites 

  • Bangkok
  • Cabuyao
  • Guangdong
  • Hong Kong
  • Kaohsiung
  • Seremban
  • Joint Ventures and other major participations*:
    • 61% share in Systems on Silicon Manufacturing Company Pte.Ltd.
    • 60% share in Jilin NXP Semiconductors Ltd.
    • 40% share in Suzhou ASEN Semiconductors Co. Ltd.
    • 27% share in Advanced Semiconductor Manufacturing Co. Ltd.

∗ approximate and >10 %

Research and Development

We believe that our future success depends on our ability to both improve our existing products and to develop new products for both existing and new markets. We direct our research and development efforts largely to the development of new High Performance Mixed Signal semiconductor solutions where we see significant opportunities for growth. We target applications that require stringent overall system and subsystem performance. As new and challenging applications proliferate, we believe that many of these applications will benefit from our solutions.

We have assembled a team of highly skilled semiconductor and embedded software design engineers with expertise in RF, analog, power management, interface, security and digital processing. To outpace market growth we invest in research and development to extend or create leading market positions, with an emphasis on fast growing sizable market segments, such as identification and smart mobile, and emerging segments, such as the Internet of Things, automotive telematics and automotive solid state lighting.

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